Tin Mate (Soldering)

Tin Mate Soldering provides reliable, high-quality soldering solutions designed for the electronics industry. Ideal for PCB assembly, SMT production, and other precision electronic applications, our solder ensures excellent conductivity, strong joints, and consistent performance. Engineered for both professionals and manufacturers, Tin Mate delivers superior results, every time.

Download Catalogue

Tin Mate X100A SAC 305

Description:

Paste Form

Tin Mate X100A SAC 305 – High-purity lead-free solder wire with excellent wetting and smooth flow. Delivers strong, reliable joints and consistent performance for professional electronic soldering applications.

Tin Mate-WF35 (Sn96.5Ag3Cu0.5)

Description:

Paste Form

Tin Mate-WF35 (Sn96.5Ag3Cu0.5) – High-performance lead-free flux-cored solder wire offering excellent wetting, stable arc, and clean joints. Designed for consistent, reliable results in professional soldering applications.

Tin Mate-C17 (Sn42Bi58)

Description:

Paste Form

Tin Mate-C17 (Sn42Bi58) – Low-temperature lead-free solder alloy designed for heat-sensitive components. Provides smooth flow, excellent wettability, and reliable joints with reduced thermal stress.

Sn99Ag0.3Cu0.7

Description:

Bar Form

Sn99Ag0.3Cu0.7 – High-purity lead-free solder alloy offering excellent wettability and stable flow. Ideal for precise, reliable soldering in electronic and industrial applications.

Sn60Pb40

Description:

Wire Form

Sn60Pb40 is a tin-lead solder alloy with excellent wetting and smooth flow characteristics. It is suitable for PCB assembly, SMT applications, and general electronic soldering, providing stable performance and reliable solder joints.

Sn97Cu3

Description:

Ring Form

Sn97Cu3 – Lead-free tin-copper solder alloy with good wettability and stable flow. Provides reliable joint strength and is suitable for general electronic and industrial soldering applications.